Prisbevakning
Få notis vid prissänkningAv: Marius I. Bâzu, Titu I. Băjenescu
Lägsta pris
än övriga butiker
Bokus

1 190 kr
Amazon
Bokbörsen
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Butiken med lägst pris i prislistan på boksidan just nu.
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use.Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructuresThis practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Avvakta – priset är högt
Bokus
416 kr dyrare
Rör sig ofta
Författare
Marius I. Bâzu, Titu I. Băjenescu
Författare
Marius I. Bâzu, Titu I. Băjenescu
Serie
Del 4 i Wiley series in quality and reliability engineering
Förlag
Wiley
Utgivningsår
2011
Sidantal
317
Språk
Engelska
Fysiska detaljer
ill.
Dewey
621.381
ISBN
9780470748244
Av: Marius I. Bâzu, Titu I. Băjenescu
Lägsta pris
än övriga butiker
Bokus

1 190 kr
Amazon
Bokbörsen
Vi har hittat boken hos 2 butiker med verifierade priser — alla är partnerbutiker som vi får provision från när du klickar på ”Visa hos butik”. Vissa butiker visas som extern länk utan pris — priset ser du först hos butiken. Priset för dig är detsamma. Frakt kan tillkomma och varierar mellan butiker och leveranssätt — kontrollera alltid aktuellt pris och leveransvillkor hos butiken innan du slutför köpet.
Skriver du om boken på en blogg eller sajt? .
Priset har nyligen gått ner jämfört med butikens eget tidigare pris.
Det lägsta priset vi sett för boken sedan Booki började mäta.
Billigaste butiken ligger under de övriga butikernas medianpris just nu — en jämförelse mellan butiker, inte ett prisfall över tid.
Butiken med lägst pris i prislistan på boksidan just nu.
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use.Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructuresThis practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Avvakta – priset är högt
Bokus
416 kr dyrare
Rör sig ofta
Författare
Marius I. Bâzu, Titu I. Băjenescu
Författare
Marius I. Bâzu, Titu I. Băjenescu
Serie
Del 4 i Wiley series in quality and reliability engineering
Förlag
Wiley
Utgivningsår
2011
Sidantal
317
Språk
Engelska
Fysiska detaljer
ill.
Dewey
621.381
ISBN
9780470748244
a practical guide for manufacturers of electronic components and systems
Marius I. Bâzu, Titu I. Băjenescu
”23% billigare” visar hur mycket lägre det billigaste priset är än medianpriset hos de övriga butikerna just nu — inte ett tidsbegränsat prisfall.
ISBN 9780470748244 jämförs hos alla butiker
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use.Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructuresThis practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Avvakta – priset är högt
Bokus
416 kr dyrare
Rör sig ofta
Författare
Marius I. Bâzu, Titu I. Băjenescu
Serie
Del 4 i Wiley series in quality and reliability engineering
Förlag
Wiley
Utgivningsår
2011
Sidantal
317
Språk
Engelska
ISBN
9780470748244
Det lägsta priset just nu är 1190 kr hos Bokus, av 2 butiker vi jämför. Priser ändras löpande – kontrollera alltid slutpris och frakt hos butiken innan köp.
Priserna uppdateras automatiskt, vanligtvis minst en gång per dygn. Senaste registrerade uppdatering: 16 juni 2026.
Varje butik sätter sitt eget pris och kör olika kampanjer, så samma bok kan kosta olika mycket. Sverige har fri prissättning på böcker – därför lönar det sig att jämföra, och här ser du priserna samlade på ett ställe.
Nej. Priset vi visar är butikens bokpris – fraktkostnad tillkommer och varierar mellan butiker (flera erbjuder fri frakt över en viss summa). Den slutliga fraktkostnaden ser du i butikens kassa innan du betalar.
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